In the realm of network switches, the performance and reliability of PCBs are of utmost importance. Our company specializes in the manufacturing of 16-layer switch PCBs, tailored to meet the rigorous demands of modern networking equipment. These PCBs have precise dimensions of 432*325mm and a board thickness of 2.0mm, with a thickness ratio of 8:1, ensuring structural stability and optimal signal transmission.
We utilize 170GRA2, a high-speed material renowned for its excellent electrical properties and low dielectric loss, which is crucial for maintaining signal integrity in high-speed data transmission. The PCBs incorporate several advanced features, including POFV (Plugged Over Via Full) technology, which enhances the reliability of via connections by filling the vias with conductive material. Small-hole back-drilling and pressed-via back-drilling are employed to minimize signal reflections and improve signal quality, especially in high-frequency applications. Additionally, precise plugging techniques are used to ensure a flat and reliable surface for component mounting.
Our manufacturing processes are highly precise, with a minimum aperture of 0.25mm and a minimum trace width/spacing of 100/100μm, enabling high-density circuit designs. The surface treatment is an OSP (Organic Solderability Preservative) finish, which provides excellent solderability while protecting the copper surface from oxidation, ensuring long-term reliability.
For inquiries or orders, please contact us at info@fr4pcb.tech. We are dedicated to delivering high-quality, reliable PCBs for your switch applications.