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Home > Multilayer PCB > Manufacturing of FR-4+RO mixed voltage PCB circuit board

Manufacturing of FR-4+RO mixed voltage PCB circuit board

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4-layer FR-4+Rogers mixed voltage PCBs leverage Rogers 5880's low dielectric loss (0.0037) and FR-4's cost-effectiveness. With 0.35mm/0.2mm trace/spacing, 0.3mm via, and ENIG finish, they ensure reliable high-frequency signal integrity.
Material Rogers 5880
Number of Layers 4 layers
Dielectric Loss Factor 0.0037
Board Thickness 0.8 ± 0.1 MM (the "+" in the original may imply a tolerance, here expressed as ± for standard notation)
Minimum Trace Width/Spacing 0.35mm/0.2mm
Process Characteristics Taconic high-frequency material (Note: Taconic is another brand of high - frequency materials, here it might be a general reference to high - frequency material properties or a possible error, but we translate as given)
Minimum Aperture 0.3mm
Surface Treatment Immersion Gold (ENIG - Electroless Nickel Immersion Gold)
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  • Type:
    SMT PCB assembly: 20 million points/day
    PCB manufacturing: 80,000 m²/month
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  • Manufacturing of FR-4+RO mixed voltage PCB circuit board
  • Manufacturing of FR-4+RO mixed voltage PCB circuit board
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  • Manufacturing of FR-4+RO mixed voltage PCB circuit board
  • Description
In modern electronic systems requiring mixed voltage operation and high-frequency performance, our 4-layer FR-4+Rogers mixed voltage PCBs offer an optimal solution. These PCBs combine the low dielectric loss and stable electrical properties of Rogers 5880 material with the cost-effectiveness and mechanical robustness of FR-4, achieving a balance between performance and economy.

Rogers 5880, with a dielectric loss factor of 0.0037, is renowned for its exceptional high-frequency characteristics, including low signal attenuation and minimal phase shift. This makes it ideal for applications such as wireless communication, radar systems, and satellite technology, where maintaining signal integrity at high frequencies is critical. The integration of FR-4 provides structural stability and reduces overall manufacturing costs, making the PCB suitable for a wide range of mixed-voltage applications.

The 4-layer structure allows for efficient power distribution and signal routing, enabling the integration of both high-voltage and low-voltage components on a single board. The minimum trace width of 0.35mm and spacing of 0.2mm ensure high-density circuit layouts, facilitating compact designs without compromising performance. The minimum aperture of 0.3mm enables precise via formation, which is crucial for maintaining signal integrity in high-frequency circuits.

The lamination pressing process ensures uniform bonding between layers, minimizing the risk of delamination and enhancing the PCB's mechanical reliability. The Immersion Gold (ENIG) surface treatment provides excellent corrosion resistance and solderability, ensuring reliable electrical connections and long-term stability in various operating environments.

For high-quality FR-4+Rogers mixed voltage PCBs, contact us at info@fr4pcb.tech.

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