HDI (High-Density Interconnect) PCBs are engineered for miniaturization and high-performance applications, featuring microvias, blind/buried vias, and ultra-fine line widths that enable higher component density in smaller form factors. Our full-service HDI PCB solution covers design optimization, precision fabrication, and high-accuracy assembly for 1+N+1, 2+N+2, and 3+N+3 HDI structures.
At FR4PCB.TECH, we utilize laser drilling, plasma desmear, and automated optical inspection (AOI) technologies to produce HDI PCBs with industry-leading precision, supporting up to 64-layer HDI structures and 0.1mm microvias for the most demanding high-density applications.
Laser-drilled microvias (0.1mm minimum diameter); plasma desmear process for reliable via plating; 2/2mil line width/space capability; strict impedance control (±3Ω) for high-speed signal integrity.
Support for 1+N+1, 2+N+2, 3+N+3 HDI layer structures; stacked, staggered, and skip microvias; blind/buried vias combination; sequential lamination process for complex HDI designs.
High-precision SMT placement (±0.02mm accuracy) for 01005 components and 0.2mm pitch BGAs; 100% AOI/X-Ray inspection for HDI assembly; conformal coating for environmental protection.
IPC-6012/2226 compliant manufacturing; thermal cycling testing (-40°C to 125°C); microsection analysis for via integrity; reliability testing (IST, HAST, PCT) for automotive/medical grade HDI PCBs.
Prototype HDI PCBs: 6-9 days; small-batch production: 10-12 days; mass production: 15-20 days; expedited 96-hour fabrication for simple HDI structures (1+N+1).
High Tg FR4 (170°C+), Rogers, TACONIC, and Panasonic M6/M7/M8 materials; halogen-free and lead-free compliant; high-frequency/low-loss materials for 5G/HDI integration.
Our HDI PCB manufacturing follows a strict, automated process flow to ensure consistent quality and precision for high-density interconnect structures:
High Tg FR4/core material cutting, laminating, and pre-treatment
UV laser drilling for microvias (0.1-0.3mm diameter) with ±5μm accuracy
Plasma treatment to remove resin smear and ensure reliable via plating
Uniform copper plating inside microvias (8-12μm thickness)
Layer-by-layer lamination for 1+N+1/2+N+2/3+N+3 structures
UV exposure for 2/2mil line width/space patterning
Precision etching and photoresist stripping for circuit formation
AOI, X-Ray, impedance testing, and microsection analysis
Our HDI PCB assembly process is optimized for high-density component placement, ensuring reliable connections and performance for compact electronic devices:
Our HDI PCB fabrication and assembly capabilities meet the most stringent industry requirements for high-density applications:
| Technical Parameter | Fabrication Capability | Assembly Capability | Quality Standard |
|---|---|---|---|
| Microvia Size | 0.1mm (diameter) × 0.15mm (depth) | - | IPC-6012 Class 3 |
| Line Width/Space | 2/2mil (0.05/0.05mm) | - | Microscope Inspection |
| HDI Structure | 1+N+1, 2+N+2, 3+N+3 (N=1-8) | - | IPC-2226 |
| Minimum Component Size | - | 01005 (0.4×0.2mm) | IPC-A-610 Class 3 |
| Minimum BGA Pitch | - | 0.2mm | 100% X-Ray Inspection |
| Placement Accuracy | - | ±0.02mm (BGA) / ±0.03mm (CHIP) | AOI Visual Inspection |
| Impedance Control | ±3Ω (50/75/90/100Ω) | - | TDR Testing |
| Copper Thickness | 1/2/1/2 oz (inner) / 1-3 oz (outer) | - | XRF Measurement |
| Material Options | FR4 (Tg 170°C+), Rogers, Panasonic M6/M7/M8 | - | Material Certification |
HDI PCBs are essential for miniaturized, high-performance electronic devices across multiple industries:
Smartphones, tablets, wearables, laptops, and portable gaming devices requiring ultra-compact PCB designs with high component density.
ADAS modules, infotainment systems, sensor hubs, and EV battery management systems (BMS) with high reliability and compact form factors.
Portable diagnostic equipment, patient monitors, implantable devices, and medical wearables requiring miniaturization and high reliability (ISO 13485 certified).
5G mmWave modules, small cell base stations, RF transceivers, and IoT gateways with high-frequency signal integrity requirements.
Avionics systems, satellite components, portable military equipment, and unmanned aerial vehicles (UAVs) with high-reliability HDI requirements.
Compact PLCs, sensor modules, robotics controllers, and machine vision systems requiring high-density interconnects in limited space.
Contact our HDI PCB engineering team to discuss your high-density interconnect requirements and receive a free design review and quote within 24 hours. We offer tailored HDI fabrication and assembly solutions for your compact, high-performance electronic devices.
ISO 9001/13485/IATF 16949 Certified | IPC Class 3 Compliance | Global HDI PCB Delivery
