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Home > Technical capabilities
Technical capabilities

Industry-leading technological capabilities

With 12+ years of professional experience, advanced equipment, and a rigorous quality control system, we ensure that every PCB/PCBA meets the highest standards.

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PCB manufacturing capabilities

From simple double-sided boards to highly complex 98-layer PCBs, we possess comprehensive manufacturing capabilities to meet a wide range of demanding application requirements.

Number of layers range

Number of layers range

Supports complex designs ranging from simple double-sided boards to ultra-high-density boards.
Floors 2-98
Standard production: 2-32 layers;
High-difficulty production: 34-98 layers
Fine lines

Fine lines

Advanced manufacturing capabilities enable high-density interconnect designs.
2/2mil
Minimum line width/spacing: 0.05mm/0.05mm;
Laser micro-via: 0.1mm
Impedance control

Impedance control

Precise impedance control ensures signal integrity.
±3Ω
Single-ended impedance: 25-125Ω;
Differential impedance: 80-120Ω
Sheet support

Sheet support

Fully supports various special materials and high-frequency and high-speed sheet
materials
15+ materials
FR4 (Standard/High Tg/Halogen-Free) High Frequency Material/Metal Substrate/Flexible Board

PCBA assembly capability

High-precision SMT production line, supporting micro-components and high-density packaging, with end-to-end quality inspection to ensure product reliability.

Component support

Component support

Fully supports various miniature and high-density packaged components
01005
Minimum component size: 01005 (0.4×0.2mm)
Minimum pitch: 0.2mm QFP/BGA
Mounting accuracy

Mounting accuracy

High-precision placement equipment ensures accurate positioning of micro-components.
±15μm
Placement accuracy: ±15μm @ 3σ
Repeatability: ±10μm
Detection capabilities

Detection capabilities

Fully automated testing ensures product quality.
100% AOI
AOI (Automated Optical Inspection)
AXI 3D X-Ray Inspection ICT/FCT Functional Testing
Production capacity

Production capacity

Multiple SMT production lines to meet different batch sizes
20 million points/day
Daily capacity: 500,000 solder joints;
Monthly capacity: 800,000+ PCBA units PCBA units

Laser direct imaging system

Investing tens of millions to introduce world-class equipment ensures manufacturing precision and product reliability.
Laser direct imaging system

Laser direct imaging system

Employing the Orbotech Paragon 8000 series, it achieves an ultra-high resolution of 5μm, ensuring accurate imaging of fine lines.
Model: Orbotech Paragon 8000
Resolution: 5μm
Production capacity: 120 pieces/hour
Automated optical inspection system

Automated optical inspection system

Equipped with the MirTec MV-7i 3D AOI system, it enables comprehensive inspection of solder joints and components, with a defect detection rate of99.9%.
Model: MirTec MV-7i
Detection speed: 40cm²/sec
Resolution: 10μm
High-precision pick and place machine

High-precision pick and place machine

Fuji NXT III series pick and place machines support 01005 micro components and 0.2mm pitch BGAs, with a placement accuracy of ±15μm.
Model: Fuji NXT III
Placement speed: 100,000 CPH
Component range: 01005 to 100mm
Detailed technical specifications

Comprehensive technical specifications to meet the needs of various applications from consumer electronics to aerospace.

project
Standard capabilities
Advanced abilities
Remark
number of floors
Floors 2-16
Floors 18-98
Supports blind and buried vias, and arbitrary layer interconnection.
Plate thickness range
0.2-3.2mm
0.1-8.0mm
Tolerance: ±10%
Minimum line
width/line spacing
3/3mil (0.075mm)
2/2mil (0.05mm)
Direct laser imaging
Minimum aperture
0.2mm mechanical drilling
0.1mm laser micro-hole
Aspect ratio: 20:1
Impedance control
±10%
±3Ω
Single-ended/differential impedance
Surface treatment
Lead-containing/lead-free solder plating, immersion gold
Immersion silver, immersion tin, OSP, electroplated hard gold
RoHS compliant
Copper thickness
range
0.5-2.0oz
3.0-12.0oz
Thick copper plate professional manufacturer
Warpage control
≤0.75%
≤0.3%
High-precision pressing process
Item
Standard capability
Advanced capability
Remark
Component type
0201, 0.4mm QFP
01005, 0.2mm BGA/QFN
Supports odd-shaped components
Placement accuracy
±25μm @ 3σ
±15μm @ 3σ
Fuji NXT III platform
Solder paste printing
±15μm repeat accuracy
±10μm repeat accuracy
DEK Horizon printer
Reflow soldering
8-zone lead-free reflow
10-zone with nitrogen protection
Precise temperature profile control
Inspection capability
2D AOI, ICT
3D AXI, FCT, flying probe test
Full-process quality control
Soldering standard
IPC-A-610 Class 2
IPC-A-610 Class 3
Automotive / medical-grade standard
Cleaning process
Water-based cleaning
Plasma cleaning
For high-reliability requirements
Conformal coating
Acrylic coating
Polyurethane / Silicone coating
Selective coating process
Test type
Capability
Standard
Application
Flying probe test
Up to 5,000 test points
IPC-9252
Prototype / small batch
ICT test
Up to 10,000 test points
IPC-9252
Medium & high-volume production
Functional test
Customized test system
Customer-specific standard
All product types
X-Ray inspection
3D AXI, 5μm resolution
IPC-A-610
BGA / CSP / hidden solder joints
Environmental test
-65°C to +150°C
MIL-STD-883
Reliability validation
Burn-in test
Up to 1,000 hours
Customer-specific requirements
High-reliability products
Signal integrity
TDR / TDT test
IEEE standard
High-speed digital circuits
EMC pre-compliance
Radiated / Conducted test
FCC / CE standard
Certification support
Material type
Brand / Model
Features
Applications
Standard FR4
ITEQ IT-180, KB-6167
Tg 140°C, low Z-axis expansion
Consumer electronics, industrial control
High-Tg FR4
Isola 370HR, Panasonic R-1755V
Tg 170–180°C, halogen-free
Automotive electronics, power products
High-frequency materials
Rogers RO4350B, Taconic RF-35
Dk 3.48, low loss
5G communications, radar systems
High-speed materials
Isola I-Speed, Panasonic Megtron 6
Low Dk/Df, signal integrity
Servers, high-speed networks
Metal-core PCB
Aluminum/Copper base, Bergquist MP
Thermal conductivity 1–3 W/m·K
LED lighting, power modules
Flexible materials
DuPont Pyralux, Panasonic R-F775
Polyimide substrate, high flex life
Wearables, foldable displays
Rigid-flex
DuPont Pyralux AP/AC
Multi-layer rigid-flex structure
Medical devices, aerospace
Ceramic substrate
Aluminum oxide / Aluminum nitride
High thermal conductivity, high reliability
High-power LED, laser devices

Certification and Standards

A comprehensive quality management system and international certifications ensure that products meet global market requirements.
ISO 9001:2015

ISO 9001:2015
Quality Management System Certification
IATF 16949

IATF 16949
Automotive Industry Quality Management System
ISO 13485

ISO 13485
Medical Device Quality Management System
UL certification

UL certification
Safety standard certification (E359428)
RoHS/REACH

RoHS/REACH
Hazardous Substance Restriction Directive
IPC Members

IPC Members
Electronic Industry Standards Association

Full-process quality control

From raw material inspection to finished product shipment, 12 quality control checkpoints ensure zero defects in the products.

Raw material inspection

Raw material inspection

All raw materials undergo rigorous inspection before being put into storage to ensure they meet specifications.
Engineering data review

Engineering data review

Professional DFM analysis helps identify potential problems early and optimize production processes.
Inner layer circuit testing

Inner layer circuit testing

AOI (Automated Optical Inspection) ensures that the inner layer circuitry is free of defects.
Post-lamination inspection

Post-lamination inspection

X-ray inspection ensures alignment between layers, guaranteeing precise interlayer alignment.
Outer layer circuit testing

Outer layer circuit testing

High-precision AOI inspection to identify circuit defects
Impedance test

Impedance test

100% impedance testing to ensure signal integrity
Final electrical test

Final electrical test

Flying probe testing/dedicated fixture testing to ensure electrical performance
Appearance inspection

Appearance inspection

IPC-A-600 standard visual inspection to ensure surface quality.

Technological advantages

FR4PCB.TECH not only provides manufacturing services, but also drives customer product success through technological innovation.
Engineering and technical support

Engineering and technical support
A team of 20+ senior engineers provides comprehensive technical support including DFM analysis, design optimization, and problem solving.
rapid response capability

Rapid response capability
2-hour technical review, 24-hour expedited prototyping, and 30% faster mass production delivery time than the industry average.
Yield assurance system

Yield assurance system
Statistical process control (SPC) throughout the entire process ensures a stable mass production yield of over 99.8%.
Continuous technological innovation

Continuous technological innovation
Annual R&D investment accounts for 8% of revenue, and we continue to introduce advanced equipment and process technologies.

Let technological strength empower your products

FR4PCB.TECH, with its leading technological capabilities and rigorous quality control, helps you create highly reliable, high-performance electronic products.

Obtain a customized technical solution