With advanced automated production lines and strict quality control systems, we offer flexible production solutions covering rapid prototyping, small batch and mass production, as well as one-stop OEM/ODM customization services.
Supports high-precision placement of industry's smallest passive components (01005/0.4×0.2mm) with ±0.03mm accuracy and 99.8% yield rate (99.9% for AI server applications).
Expertise in 0.2mm pitch BGA/QFP/QFN assembly with 100% X-Ray inspection for soldering quality. Supports BGA rework with preheating & anti-static protection.
Double-sided SMT placement (unlimited component density) + SMT+THT hybrid assembly (through-hole insertion, wave soldering, manual soldering).
UHDI Technology: Up to 8 layers HDI stack-up, microvias (0.1mm), blind/buried vias for high-density interconnects.
Ultra-Low Loss: DF values as low as 0.0012 for minimal signal attenuation in 40Gbps+ high-speed transmission.
Thermal Stability: High Tg (up to 170°C) for reliable performance in high-temperature AI server environments.
| Technical Item | Standard Capability | Advanced Capability (AI Server) | Inspection Standard |
|---|---|---|---|
| Minimum Component Size | 01005 (0.4×0.2mm) | 01005 (99.9% placement accuracy) | IPC-A-610 Class 3 |
| Minimum BGA Pitch | 0.2mm | 0.2mm (X-Ray 100% inspection) | X-Ray 100% Inspection |
| Placement Accuracy | ±0.03mm (CHIP) | ±0.02mm (BGA) | AOI Visual Inspection |
| PCB Layer Count | 2-64 Layers | 8-98 Layers (focus on 8-64) | Impedance Testing (±3Ω) |
| Minimum Line Width/Space | 3/3mil (0.075mm) | 2/2mil (0.05mm) | Microscope Inspection |
| PCB Size/Thickness | Max 500×450mm / 0.1-8.0mm | 0.1-12.0mm (thick copper 10-20oz) | Dimension Inspection (CMM) |
DK:2.2-10.2, DF:0.0009-0.0025, -55°C to 150°C | Applications: 5G, RF, Microwave
DK:2.3-10.6, DF:0.0008-0.0030, -65°C to 160°C | Applications: Aerospace, Defense
DK:2.4-9.8, DF:0.0010-0.0040 | Applications: Telecom, Automotive, Industrial
| Material Grade | Model | DK Value | DF Value | Key Features |
|---|---|---|---|---|
| Panasonic M6 | R5775 | ≈3.0 | ≈0.0012 | Low loss for 10Gbps+ applications |
| Panasonic M7 | R578 | ≈3.3 | ≈0.0015 | High reliability for 25Gbps transmission |
| Panasonic M8 | R579Y | ≈3.6 | ≈0.0020 | Ultra-low loss for 40Gbps+ AI servers |
| TU-883/EM-370 | - | ≈3.4-3.5 | ≈0.0035-0.0040 | Cost-effective, high Tg (170°C) |
Flexible Lead Time (Expedited Services Available for All Orders)
AI servers, server motherboards, industrial computers, storage devices
Smartphones, tablets, wearables, smart home appliances
ADAS, charging piles, vehicle control modules, dash cams
Monitors, blood glucose meters, medical sensors, diagnostic equipment
PLC, inverters, industrial control motherboards, sensor modules
Routers, base stations, optical modules, IoT gateways, 5G/6G devices
Satellite equipment, avionics, flight control systems, navigation modules
Multimeters, oscilloscopes, energy meters, pressure/temperature testers
48h standard prototype, 24h urgent delivery for high-complexity PCBs
01005 components, 0.2mm BGA, 2mil/2mil line width, ±3Ω impedance control
99.8% yield rate, IPC-A-610 Class 3, ISO 13485/IATF 16949 certified
From design to prototyping, assembly, testing and global delivery
1000+ global customers, 80% repeat purchase rate, confidential NDA agreement
Factory-direct pricing, transparent cost breakdown, volume discounts
24/7 engineering support, free DFM analysis, lifetime consultation
2-98 layers PCB, blind/buried via, thick copper (10-20oz)
Contact our team today to discuss your needs and get a free quote within 24 hours.
Email: info@fr4pcb.tech | Phone: +86-181-8231-8008 | WhatsApp: +86-18123677761
Global Delivery | ISO 9001/13485/IATF 16949 Certified | NDA Protection Available
