Services offered

From complex prototyping to mass production, from design optimization to one-stop solutions, we provide professional electronics manufacturing services covering the entire product lifecycle.

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High-difficulty PCB prototype manufacturing

Specializing in 8–64 layer (up to 98 layers) complex PCB structures, meeting stringent requirements for high-density interconnects, high frequency and speed, and high reliability.

Professional manufacturing capabilities

With advanced PCB manufacturing equipment and over 12 years of industry experience, we focus on solving the most challenging and complex PCB manufacturing problems. From microvia technology to special material processing, we ensure that every circuit board meets the highest quality standards.

✅Number of layers range: Floors 8-64 (up to 98 floors supported)
✅Minimum line width/line spacing: 2mil/2mil (0.05mm/0.05mm)
✅Minimum aperture: 0.1mm laser micro-hole
✅Impedance control: ±3Ω Precise contro

🌱Applicable materials
✅FR4 (Standard/High Tg/Halogen-free)
✅High-frequency materials (Rogers, Taconic, Arlon)
✅Metal substrate (aluminum-based/copper-based)
✅Flexible/rigid-flexible composite board

📶Typical application scenarios
✅Communication equipment and 5G infrastructure
✅Medical Electronics and Life Science Devices
✅Aerospace and defense industry
✅Automotive Electronics and New Energy Systems

High-precision PCBA assembly

Supports high-density component mounting such as 01005 micro-packages, 0.2mm pitch QFPs, and micro BGAs, providing full-process services including SMT, DIP, and hybrid assembly.

Precision assembly technology

Our SMT production line is equipped with world-leading placement equipment, supporting high-precision placement from micro 01005 components to large BGA packages. The entire process complies with the IPC-A-610 Class 3 standard, ensuring that every PCBA has superior reliability and performance.

✅Component support: 01005, 0.2mm pitch QFP, 0.3mm BGA
✅Mounting accuracy: ±15μm @ 3σ
✅Detection capabilities: AXI, AOI, ICT, FCT full-process inspection
✅Welding Standards: IPC-A-610 Class 3

🌱Process capabilities
✅Lead-free/lead-containing soldering processes
✅Selective wave soldering and localized welding
✅Conformal coating and underfill
✅X-Ray Inspection and Repair

🔬Quality Assurance
✅ 100% AOI Automated Optical Inspection
✅ Key node X-Ray detection
✅ Functional testing and aging testing
✅Complete traceability system

PCB Design and Layout

We provide end-to-end design services from schematic to PCB layout, including high-speed signal integrity analysis, electromagnetic compatibility (EMC) optimization, and power integrity (PI) design.

Professional design services

Our design team possesses extensive industry experience and is proficient in various circuit designs, including high-speed digital, RF, and power circuits. We focus not only on functional implementation but also on manufacturability (DFM), testability (DFT), and cost optimization to ensure design success on the first attempt.

✅Design tools:Altium Designer, Cadence Allegro, Mentor PADS
✅Layer support:Complex design of 2-64 layers
✅Signal Analysis:SI/PI/EMC Simulation and Optimization
✅Design cycle:30% faster than the industry average

📊Design services scope ✅Schematic Design and Component Selection
✅PCB layout and routing optimization
✅High-speed signal integrity analysis
✅Power integrity and thermal design
✅EMC/EMI Problem Prevention and Solution

✨Design Advantages
✅DFM/DFA design optimization reduces manufacturing costs.
✅Seamless collaboration with the manufacturing team reduces design iterations.
✅Extensive industry design experience library
✅Rigorous design review process

BGA repair service

Equipped with a high-precision BGA rework station (±5μm positioning accuracy), it supports the disassembly, assembly, ball repositioning, and resoldering of 0.2mm pitch micro BGA chips, with a repair success rate of99%.

Precision rework technology

Our BGA rework center is equipped with world-leading rework equipment and an experienced technical team, capable of handling all kinds of complex rework needs, from replacing a single BGA chip to repairing an entire board, ensuring a high success rate and reliability.

✅Positioning accuracy:±5μm high-precision alignment
✅Minimum spacing:0.2mm pitch BGA
✅Success rate:99% success rate of repair
✅Detection capabilities:3D X-Ray Real-time Detection

🔬Repair service
✅scope BGA/CSP/QFN chip replacement
✅Ball-mounting and re-welding services
✅PCB pad repair
✅Lead-free/lead-containing process conversion

👍Application scenarios
✅ Prototype modification during the research and development phase
✅Small batch production issue fixes
✅Repair and upgrade of expensive circuit boards
✅Failure Analysis and Root Cause Investigation