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Professional PCB Prototype Prototyping Service

We have been deeply engaged in the PCB prototyping field for many years, focusing on solving high-difficulty, ultra-process PCB customization needs. We excel especially in fast prototyping of special processes such as 4-layer and above multi-layer boards, thick copper/ultra-thick copper, extra-large size, and ultra-thick sheets. From impedance control, high-TG sheet selection, to thick copper electroplating, extra-large size processing, and ultra-thick board lamination, we can provide a one-stop solution to meet the strict requirements of high-end industrial fields like new energy, power electronics, and rail transit.

Core PCB Prototyping Types

Core PCB Prototyping Types

4-98 Layer PCB Board

Supports 4-64 layers prototyping, up to 98 ultra-high layers processing

Line width/space: 3mil/3mil (reg) | 2mil/2mil (limit)

Interlayer alignment: ±0.025mm (inner) / ±0.05mm (outer)

Min aperture: 0.1mm (4mil)

Dielectric thickness control: ±0.01mm

Board thickness: 0.2-12.0mm

72h expedited delivery for AI server boards

Applications: Industrial control, AI servers, communication devices

Impedance Controlled PCB

Precise characteristic impedance control for high-frequency signals

Line width/space: 3mil/3mil (reg) | 2mil/2mil (limit)

Impedance accuracy: ±5% (reg) / ±3% (high-precision)

Supported types: Single-ended (40-120Ω), Differential (80-150Ω)

Test standard: IPC-TM-650 (100% batch inspection)

Common values: 50Ω/75Ω/90Ω/100Ω/120Ω

Applications: RF, high-speed communication products

High TG PCB

TG ≥170℃/180℃/200℃ with excellent heat resistance

Core laminates: Halogen-free FR-4, high silica, PTFE composite

PTFE: Temp resistance ≥260℃, Df≤0.002 (1GHz), UL94 V-0

Thermal shock: 288℃ solder bath 10s (no delamination)

Applications: Automotive electronics, industrial high-temp equipment

Metal Substrate (Copper Substrate)

High thermal conductivity & current-carrying capacity

Material: Red copper (T2/T3), Brass (H62/H65), purity ≥99.9%

Thickness: 0.1-6.0mm (tolerance ±0.02mm)

Thermal conductivity: ≥380W/(m·K) (pure copper)

Temp resistance: -50℃~200℃ (long-term), ≥300℃ (short-term)

Applications: High-power LED, new energy inverters, industrial power

PCB Product Specifications

HDI PCB

High-Density Interconnect (HDI) PCB supports microvias, blind/buried via processes, greatly improving PCB integration. Complete range of UHDI high-frequency and high-speed materials dedicated to AI servers are available, suitable for mobile phones, tablets, wearable devices, AI servers and other products:

  • Line width/space limit: Standard 3mil/3mil, Limit: 2mil/2mil (0.05mm/0.05mm)
  • Microvia diameter: Minimum 0.1mm (4mil)
  • Minimum diameter of buried/blind vias: 0.15mm (6mil)
  • Stack-up structure: 1+N+1, 2+N+2, Any-order HDI
  • Minimum dielectric thickness: 0.05mm

High-Frequency PCB

High-Frequency PCB adopts a full range of high-frequency laminates, optimizing dielectric constant (Dk) and dissipation factor (Df) to reduce signal attenuation, suitable for high-frequency equipment such as radar, satellite communication, 5G base stations, AI servers:

  • Core laminates: Rogers, TACONIC, ISOLA, arlon, F4BTP-2, FR-4
  • Dielectric constant (Dk): 2.2-10.6
  • Dissipation factor (Df): ≤0.002 (1GHz) (Teflon substrate)
  • Frequency range: DC-60GHz
  • Typical applications: 5G base stations, satellite communication, radar, high-speed interconnection of AI servers

High-Speed PCB

High-Speed PCB is designed for high-speed serial buses (such as USB3.0/4.0, PCIe, DDR4/5, etc.), adopting professional high-speed laminates to ensure distortion-free transmission of high-speed signals:

  • Core laminates: Panasonic M6(R5775), M7(R578), M8(R579Y), TU-883, EM-370
  • Dielectric constant (Dk): ≈3.0-3.6
  • Dissipation factor (Df): ≈0.0012-0.004
  • Signal rate support: Up to 56Gbps PAM4
  • Impedance control: Differential impedance 100Ω±3%, Single-ended impedance 50Ω±3%

Rigid-Flex PCB

Rigid-Flex PCB combines the stability of rigid PCB and the bendability of flexible PCB, supporting complex 3D assembly, suitable for foldable screen devices, medical instruments, aerospace equipment, etc.:

  • Line width/space limit: 2mil/2mil (0.05mm/0.05mm)
  • Minimum bending radius of flexible area: R0.3mm
  • Bending times of flexible area: ≥100,000 times (-40℃~85℃)
  • Number of rigid layers: 2-40 layers, Number of flexible layers: 2-8 layers
  • Minimum aperture: 0.1mm, Board thickness range: 0.2-6.0mm
Glass/Ceramic/Halogen-Free Special Substrate

Special substrates meeting environmental protection, high thermal conductivity, high insulation, and high-temperature resistance requirements, covering new energy, medical, aerospace and other high-end fields:

  • Halogen-free characteristics: Halogen content ≤900ppm (Cl≤900ppm, Br≤900ppm, Cl+Br≤1500ppm), compliant with RoHS/REACH environmental standards
  • Ceramic substrate: Alumina (Al₂O₃) content ≥96%, thermal conductivity ≥20W/(m·K), insulation withstand voltage ≥20kV/mm, coefficient of thermal expansion (CTE) ≤7ppm/℃
  • Glass substrate: Borosilicate glass material, dielectric constant Dk=4.5±0.2, flexural strength ≥150MPa, temperature resistance ≥500℃, excellent thermal stability
  • Peelable substrate characteristics: Peel strength ≥1.0N/mm (room temperature), ≥0.8N/mm (150℃ high temperature), residue-free peeling of protective layer
  • Typical applications: New energy vehicle power electronics, medical high-end equipment, aerospace high-temperature components
Heavy Copper/Ultra Heavy Copper PCB

Core processes for high current carrying capacity, covering full specifications of heavy and ultra-heavy copper, with industry-leading electroplating and etching control capabilities:

  • Heavy copper: ≥3oz (105μm), mainstream application: 5oz (175μm)
  • Ultra heavy copper: ≥6oz (210μm), maximum up to 15oz (525μm)
  • Copper thickness control accuracy: Heavy copper ±5μm, Ultra heavy copper ±8μm
  • Core applications: New energy storage, power electronics, rail transit
Extra Large Size PCB

Solving high integration and structural integration needs, breaking through conventional size limitations:

  • Extra large size: ≥1200mm×2400mm, maximum up to 1500mm×3000mm
  • Dimensional tolerance: ±0.1mm/100mm, maximum deviation ≤0.5mm
  • Warpage: ≤0.75% (highest grade ≤0.5%)
  • Core applications: Industrial control backplanes, medical imaging equipment, rail transit main control boards
Extra Thick Laminate PCB

Laminate processes meeting high mechanical strength and insulation performance requirements:

  • Extra thick laminate: ≥6.0mm, maximum up to 12.0mm
  • Laminate thickness tolerance: 6-8mm ±0.1mm, 8-12mm ±0.15mm
  • Drilling capability: Hole diameter ≥0.3mm, aspect ratio ≤10:1
  • Core applications: New energy storage cabinets, high-voltage frequency converters, large industrial control chassis

Core process capabilities and industry applications

PCB Process Technology

Thick Copper/Ultra-Thick Copper Process

1. Copper Thickness Definition (Industry Universal Standard)

Conventional copper thickness: 1oz (35μm), 2oz (70μm)

Thick copper: ≥3oz (105μm), mainstream application 5oz (175μm)

Ultra-thick copper: ≥6oz (210μm), maximum achievable 15oz (525μm)

2. Core Process Capabilities

Process Link Thick Copper (3-5oz) Capability Ultra-Thick Copper (6-15oz) Capability
Copper Thickness Control Precision ±5μm (overall) / ±3μm (local) ±8μm (overall) / ±5μm (local)
Etching Precision Line width/space ≥0.2mm, tolerance ±0.02mm Line width/space ≥0.3mm, tolerance ±0.03mm
Electroplating Uniformity Board surface copper thickness deviation ≤8% Board surface copper thickness deviation ≤10%
Lamination Bonding Strength ≥1.2N/mm (no delamination after thermal shock) ≥1.0N/mm (no delamination after thermal shock)
Thermal Stress Resistance -40℃~125℃ thermal cycle ≥1000 times -40℃~150℃ thermal cycle ≥800 times

3. Core Process Control Points

  • Electroplating: High current density pulse electroplating + special thick copper plating solution (ensure density/uniformity)
  • Etching: Etching compensation design + segmented etching (avoid excessive side etching)
  • Lamination: Pre-pressing exhaust, pressure 25-35kg/cm², heating rate 2-3℃/min

Extra-Large Size PCB Process

1. Size Definition (Industry Classification)

Conventional size: ≤600mm×800mm

Large size: 800mm×1200mm ~ 1000mm×2000mm

Extra-large size: ≥1200mm×2400mm (max achievable 1500mm×3000mm)

2. Core Process Capabilities

Detection Dimension Extra-Large Size PCB Capability Index Control Measures
Dimensional Tolerance ±0.1mm/100mm, max deviation ≤0.5mm Large high-precision CNC positioning + real-time size compensation
Warpage ≤0.75% (highest grade ≤0.5%) Substrate pre-baking + symmetric lamination design
Lamination Alignment Precision ±0.05mm (inner) / ±0.08mm (outer) Laser positioning + CCD visual alignment system
Surface Treatment Uniformity ENIG/Tin plating thickness deviation ≤1μm Full board uniform spray + zonal flow control

3. Process Difficulties & Solutions

  • Substrate deformation: Low CTE substrate + stress relief baking before cutting
  • Processing precision: Gantry-type large CNC + vacuum adsorption platform
  • Inspection: Automatic large-size AOI/AXI dead-angle-free inspection

Ultra-Thick Substrate PCB Process

1. Substrate Thickness Definition

Conventional thickness: 0.2mm ~ 3.2mm

Thick board: 3.2mm ~ 6.0mm

Ultra-thick board: ≥6.0mm (maximum achievable 12.0mm)

2. Core Process Capabilities

Process Link Ultra-Thick Board (6-12mm) Capability Process Key Points
Board Thickness Tolerance ±0.1mm (6-8mm) / ±0.15mm (8-12mm) Stepwise lamination pressurization + real-time thickness monitoring
Drilling Capability Aperture ≥0.3mm, aspect ratio ≤10:1 Cemented carbide drill + segmented drilling + high-pressure chip removal
Routing Precision ±0.1mm Low-speed cutting + multiple passes to eliminate stress
Mechanical Strength Bending strength ≥300MPa High-toughness resin system substrate

AI Server-Specific PCB Process

1. Core Layer Count Capability

Standard processing: 4-64 layers

Maximum achievable: 98 ultra-high layer count processing

Expedited delivery: 72-hour rapid prototyping & delivery

2. Material System

Type Core Materials Key Parameters
UHDI High-Frequency Material Rogers, TACONIC, ISOLA, arlon, F4BTP-2 Dk:2.2-10.6, low loss
High-Speed Material Panasonic M6/M7/M8, TU-883, EM-370 Dk≈3.0-3.6, Df≈0.0012-0.004

3. Core Process Advantages

  • UHDI process: Supports microvias, blind/buried vias (high-density interconnection)
  • Signal Integrity: Precise impedance control (ensure high-frequency/high-speed transmission)
  • Delivery Efficiency: 72-hour expedited delivery for ultra-high layer counts

Core Industry Application Scenarios

Industry Sector Core Process Requirements Typical Products & Process Requirements
New Energy (Energy Storage/Charging Pile) Thick copper (6-10oz) + extra-large size + ultra-thick board Energy storage cabinet busbar PCB: 10oz copper, 1200×2000mm, 8mm thickness
Power Electronics (Inverter/Power Cabinet) Ultra-thick copper (8-15oz) + ultra-thick board + high TG halogen-free substrate High-voltage inverter PCB: 12oz copper, 6mm thickness, 10kV resistance, TG180 halogen-free
Rail Transit (Locomotive Control) Extra-large size + thick copper + high-temperature process + high TG glass substrate Locomotive main control board: 1000×1800mm, 5oz copper, TG200 high-silica glass, Teflon HF layer
Automotive Electronics (Engine Compartment) High TG (≥180℃) + halogen-free + humidity/heat resistance Engine control board: TG200 halogen-free, 150℃ long-term operation, humidity/heat cycle ≥2000h
AI Server Ultra-high layer count + UHDI + high TG high-speed substrate AI computing board: 72 layers, UHDI process, TG180 high-speed, impedance control ±3%
Core Competitive Advantages

Core Competitive Advantages

Ultra-Fast Delivery

96-hour expedited delivery for AI server-specific PCBs, 150-hour prototyping for conventional high-difficulty PCBs, industry-leading delivery efficiency.

Superior Process Capabilities

Full-process capabilities covering 98-layer ultra-high layer count, 15oz ultra-thick copper, 1500×3000mm ultra-large size, and 12mm ultra-thick PCBs.

Stringent Quality Control

Full-process AOI/AXI inspection, 100% impedance testing, full coverage of reliability tests (thermal shock, thermal cycle), yield rate ≥99%.

Customized Solutions

Provide exclusive material selection and process design for different industry needs, one-stop solution for high-difficulty PCB customization challenges.

PCB Multilayer Board Prototyping Timeline | Industry's Highest Technical Standards

PCB Multilayer Board Prototyping Timeline

Highest Industry Technical Standards · Precise Time Commitment · Professional Process Guarantee

4-Layer Board Fastest Delivery in 72 Hours | 6-Layer Board Fastest Delivery in 96 Hours

Our Technical Capabilities

High-Speed Materials

Panasonic M6/M7/M8, TU-883, EM-370 with DK≈3.0-3.6, DF≈0.0012-0.004

High-Frequency Materials

Rogers, TACONIC, ISOLA, Arlon, F4BTP-2, FR-4, DK: 2.2-10.6

AI Server Solutions

UHDI process, 01005 components, 0.2mm BGA, high-density interconnect

Key Premise Explanation

The time unit below is working days (excluding Saturdays, Sundays, and public holidays), starting from the date the manufacturer confirms that the Gerber documents and process requirements are correct. We offer two services: "Standard Prototyping" (mainstream choice, cost-effective) and "Expedited Prototyping" (fast prototyping, higher cost, for urgent needs). If special processes are involved (high-precision impedance, blind/buried vias, high-frequency materials, thick copper, stepped grooves, etc.), the time will be increased accordingly.

Time Calculation Rules

• Time Calculation Start: The date when the manufacturer confirms the Gerber documents and process requirements are correct

• Working Days Definition: Excluding Saturdays, Sundays, and public holidays

• Expedited Service: Only applicable to boards without complex processes, additional expedited fees required

• Special Processes: Will significantly affect delivery time, please communicate and confirm in advance

PCB Multilayer Board Prototyping Timeline

PCB Layer Count Standard Prototyping Time
(Working Days)
Expedited Prototyping Time
(Working Days)
Additional Processing Time for Special Processes
(Working Days)
4 Layer 2-3 1-2 +1
6 Layer 3-4 2 +1
8 Layer 4-5 2-3 +1-2
12+ Layer 6-8 4-5 +2-3
18+ Layer 8-10 6-7 +3
20+ Layer 10-12 7-8 +3-4
44+ Layer 18-22 12-15 +4-5 (DFM review required 1-2 days in advance)

Additional Notes

44+ Layer Classification: Ultra-high multilayer boards (commonly used in servers and high-end communication equipment). A manufacturability (DFM) review must be conducted before prototyping. The timeframes in the table above already include the basic review period.

Time Example: A 4-layer board can be delivered in as fast as 48 hours (1 working day), and a 6-layer board in 72 hours (without special processes).

Comparison with Small/Medium Manufacturers: Small and medium manufacturers typically take 1-3 working days longer than the times listed above, and most do not have the capacity to undertake 44+ layer boards.

Impact of Special Processes: Special processes such as high-frequency/high-speed materials, HDI, microvia technology, etc., will significantly increase production time. It is recommended to communicate with engineers in advance to confirm specific timelines.

Key Summary

Multilayer PCB prototyping time increases stepwise with the number of layers. 44+ layer boards take 6-10 times longer than 4-layer boards. Expedited prototyping is only applicable to boards without complex processes and requires additional expedited fees. Special processes significantly affect delivery time. DFM review must be completed in advance for 44+ layer ultra-high multilayer boards. We commit to providing the highest industry technical standards to ensure your project is completed quickly and efficiently.

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Support 4-44+ Layer PCB Prototyping | Comprehensive High-Frequency High-Speed Materials | UHDI Process | 01005/0.2mm BGA Rapid Prototyping

Contact us: info@fr4pcb.tech | Specializing in AI Server PCB Solutions