Complete range of high frequency materials with DK values from 2.2 to 10.6, meeting the most demanding high frequency application requirements
Industry-leading high frequency material with excellent electrical performance and temperature stability
High performance PTFE-based laminates for high frequency and high speed applications
High reliability materials with consistent electrical properties across frequency ranges
Cost-effective high frequency materials with excellent mechanical properties
High performance fluoropolymer composite material for extreme environments
High-Tg FR-4 with optimized high frequency performance for general applications
Panasonic high speed materials with ultra-low DF values, optimized for high speed signal transmission in AI servers and data centers
| Material Grade | Model | DK Value | DF Value | Key Features |
|---|---|---|---|---|
| Panasonic M6 | R5775 | ≈3.0 | ≈0.0012 | Low loss, excellent signal integrity for 10Gbps+ applications |
| Panasonic M7 | R578 | ≈3.3 | ≈0.0015 | High reliability, optimized for 25Gbps high speed transmission |
| Panasonic M8 | R579Y | ≈3.6 | ≈0.0020 | Ultra-low loss, ideal for 40Gbps+ high speed AI server applications |
| TU-883 | - | ≈3.5 | ≈0.0040 | Cost-effective high speed material with good thermal stability |
| EM-370 | - | ≈3.4 | ≈0.0035 | High Tg (170°C), excellent for high density AI server PCBs |
Industry's highest technical standards for AI server PCB/PCBA manufacturing, supporting ultra-difficult processes and ultra-fast prototyping to accelerate your AI innovation.
Complete UHDI high frequency and high speed material solutions with up to 8 layers of HDI stack-up.
PCB and PCBA ultra-fast prototyping with 120-hour turnaround for urgent AI server development projects.
Precision assembly of 01005 ultra-small components with 99.9% placement accuracy.
Expertise in 0.2mm pitch BGA assembly and rework with X-Ray inspection for 100% quality assurance.
Solving ultra-difficult manufacturing challenges that others cannot handle - pushing process limits.
Compliant with IPC-A-610 Class 3 and IATF 16949 standards for automotive-grade reliability.
PCB Ultra-Fast Prototyping Turnaround for AI Server Applications
PCBA Ultra-Fast Prototyping Turnaround with 0.2mm BGA Assembly
We understand the time-sensitive nature of AI server development - our ultra-fast prototyping capabilities accelerate your time-to-market by 30% compared to industry standards.
Urgent PCB prototyping for high frequency/high speed materials with 24-hour turnaround, including impedance control and microvia processing.
Complete PCBA assembly with 01005 components and 0.2mm BGA in 48 hours, including AOI and X-Ray inspection.
Strategic partnerships with DHL/FedEx ensure global delivery of prototypes within 5-7 days after production completion.
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