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Home > Communication Equipment PCB assembly > 10-Gigabit switch PCB assembly

10-Gigabit switch PCB assembly

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Provides 16-32 layer high-speed PCB solutions for data center/enterprise 10-Gigabit switches, supporting 224G PAM4 signal transmission, thermal management via liquid cooling + 3D vapor chamber technology, passing IEEE 802.3ck & UL certifications, with ≥99.1% mass production yield and 48-hour expedited prototyping.
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  • Type:
    SMT PCB assembly: 20 million points/day
    PCB manufacturing: 80,000 m²/month
Quantity:
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
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  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • 10-Gigabit switch PCB assembly
  • Description

I. Core Performance Parameters (Industry Benchmarking)

Metric Technical Specifications Competitive Gap
Signal Rate 224G PAM4 (scalable to 1.6T) Supports CPO co-packaged optics integration ⭐
PCB Layers 16-32 layer AnyLayer HDI Trace width/spacing 35μm
Insertion Loss ≤0.5dB/inch @56GHz Optimized via Keysight EMPro
Thermal Resistance 0.15℃/W (liquid cooling) 60% temperature reduction vs. air cooling
Power Density 8W/cm² (@100Gbps port) Compliant with ENERGY STAR v8.0

Data Insight: IDC 2025 reports the global 10GbE switch market at $18.7B, with liquid cooling penetration rising to 35% and 224G PAM4 demand growing 41% annually.

II. Material & Process Innovations

High-Speed Material Solutions:

  • Panasonic MEGTRON 7 (Df=0.0015 @56GHz) – Preferred for 224G backplanes
  • Shengyi Synamic 6 (32% cost reduction for domestic alternatives) – Certified by Huawei/Cisco
  • Embedded capacitor material (ZBC2000) – 40% power supply noise suppression

Signal Integrity Assurance:

graph TB
A[Differential pair length tolerance ±0.1mm] --> B[Backdrill stub control]
C[Hybrid laser drilling accuracy ±15μm] --> D[32-channel TDR testing]

III. Cost & Delivery Competitiveness

Service Type Technical Specifications Price Lead Time
16-layer prototype (5 pcs) 224G PAM4 channels $320/board 48 hours
24-layer mid-volume (1K pcs) Liquid cooling + 6 power planes $42/unit 12 days
32-layer + optical engine CPO solution (1.6Tbps) Custom quote 30 days

⚠️ Industry Pain Point: TechInsights 2025 notes signal integrity defects cause 10% of switch returns. This solution reduces risk to 0.3% via DFM automated verification systems.

IV. Reliability Verification System

Environmental Testing:

  • 85℃/85%RH aging for 1,000 hours – Insulation resistance maintained >10⁸Ω
  • 3,000 thermal cycles (-55℃~125℃) – No microcracks detected

Electromagnetic Compatibility:

  • Radiated interference <30dBμV/m @10m (exceeding FCC Class B limits)
  • ESD protection ±15kV (IEC 61000-4-2 Level 4)

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