PCB production and assembly equipment
FR4PCB.TECH 2025 Smart Manufacturing Equipment Showcase｜Nanoscale Precision × Zero-Defect Delivery
🔥 Precision Machining:
- 6μm Laser Drill (±1.2μm):
- Supports ABF materials for IC substrates, with HAZ <5μm.
- LDI Exposure System:
- Achieves ≤8μm line widths with ±2% impedance control for 5G mmWave boards (dedicated 77GHz radar line).
- Pulsed Electroplating Line:
- Ensures 100% filling of 50μm blind vias, boosting yield by 30% for military-grade HDI boards.
⚡ Intelligent Assembly:
- 01005 SMT Placement Machine (AI Compensation ±8μm):
- Enables mass production for Tesla V2X modules.
- Vacuum Nitrogen Reflow Oven (O₂ ≤8ppm):
- Achieves 99.8% yield for OSP solder joints.
- 3D X-Ray Inspector:
- Detects BGA void rates <1% in 60-layer boards (certified for satellite communication PCBs).
🌿 Green Smart Manufacturing:
- Cyanide-Free Immersion Gold Line:
- Compliant with RoHS 3.0, reduces wastewater toxicity by 92%.
- Waste Gas Plasma Treatment (VOCs Purification >99%):
- Certified under CBAM (Carbon Border Adjustment Mechanism).
